BE 330 Lab 2: Simulating Circuits with LTspice or MultiSim
BE 330 Lab 2: Simulating Circuits with LTspice or MultiSim
Read the entire lab instructions before starting the lab assignment. You should do this for every lab, every week. It is important to read the entire lab first because often, you will be connecting multiple components together, and you need to understand each component before connecting them together. If you just try to serially read and complete the instructions, you will get stuck because vital information for completing specific steps may appear later in the instructions.
There will be many breakout rooms that you may self-assign yourselves to, to identify the people you would like to work with and help each other with the debugging. You are highly likely encouraged to ask your peers before looking for a TA, peer instructor, or the professor.
If you need to refuel, please stay away from the electronics, wash your hands, and consume your food or drink. You do not want to consume heavy metals or fry your $300 instrument.
Your webcam should be on throughout the whole lab, but feel free to turn off your webcam for a short while if you need to use the restroom, tend to an unexpected guest, etc. Not turning on the webcam will not allow you to be checkout (which means that you may lose major points for your lab).
BE 330 Lab 2: Simulating Circuits with LTspice or MultiSim
Introduction
Circuit simulation is one of the oldest applications of computer simulation. SPICE (“Simulation Program with Integrated Circuit Emphasis”), the original circuit simulation program, was first released in 1973. Forty-eight years later, SPICE is still the de facto standard for circuit simulation. Whether you are using LTSpice, MultiSim Live, or the full version of MultiSim, the core of the software you are using is still SPICE.
SPICE is initially inspired the need to obtain realistic input/output characteristic circuit without building a breadboard circuit. This situation is extremely common in building integrated circuit (IC) chips, for which breadboarding is highly impractical due to the high amount of circuitry components involved. Building IC chips often require high-quality photolithographic masks and product failure can be catastrophically costly.
DETAILED ASSIGNMENT
